Techonology&capability |
| Items |
Mass Production
|
Sample |
| Max.Layer
Count |
8Layers |
10Layers |
| |
21"x24" |
21"x26" |
| |
3.2mm |
5.8mm |
|
|
|
|
| Min.Trace
Width/Spacing |
|
|
| Outer Layer
|
3.5/3.5mils |
3/3mils |
| Inner
Layer |
3.5/3.5mils |
3/3mils |
|
|
|
|
| Min.Board
Thickness |
2L:12mils |
2L:12mils |
|
|
4L:16mils |
4L:14mils |
|
|
6L:32mils |
6L:24mils |
|
|
|
|
| |
12mils
for SMT |
12mils
for SMT |
|
|
24mils for
BGA |
20mils for
BGA |
|
|
|
|
| Min.Drill
Size&Aspect Ratio |
0.2mm Drill
for 0.8mm |
0.2mm Drill
for 0.8mm |
|
|
Thickness(4.0:1) |
Thickness(4.0:1) |
|
|
0.25mm Drill
for 1.6mm |
0.25mm Drill
for 1.6mm |
|
|
Thickness(6.4:1) |
Thickness(8.0:1) |
|
|
0.30mm Drill
for 2.4mm |
0.30mm Drill
for 2.4mm |
|
|
Thickness(8.0:1) |
Thickness(9.6:1) |
|
|
|
|
| |
HASL,Entek |
HASL,Entek
Cu 19, |
|
|
Electronic
Gold |
Electronic
Gold |
|
|
Selective |
Selective |
|
|
Immersion
Tin |
Immersion
Silver |
|
|
Immersion Gold |
Immersion
Gold |
|
|
Plus
OSP |
Plus
OSP |
|
|
|
|
| Controlled
Impedance |
+/-
10% |
+/-7% |
|
|
|
|
| Contouring
|
Routing,V-Groove, |
Routing,V-Groove, |
|
|
Bevelling |
Bevelling
|
|
|
|
|
| Hol Dlameter
|
+/- 2 mil
|
+/- 2 mil |
|
|
|
|
| Min.S/M Thickness |
0.4 mil |
0.6 mil |
|
 |
Tel: 0755-27419818 27419598
Fax: 0755-27419528
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